Light emitting device and method of fabricating the same

ABSTRACT

Disclosed are a light emitting device and a method of fabricating the same. The light emitting device includes a substrate; first and second light emitting cells, each including a first semiconductor layer, an active layer, and a second semiconductor layer; and a connector located between the first and second light emitting cells and the substrate, to electrically connect the first and second light emitting cells to each other. The connector extends from the second semiconductor layer of the first light emitting cell, across the substrate, and through central regions of the second semiconductor layer and active layer of the second light emitting cells, to contact the first semiconductor layer of the second light emitting cell.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.12/950,676, filed on Nov. 19, 2010, and claims priority from and thebenefit of Korean Patent Application No. 10-2009-0135309, filed on Dec.31, 2009, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present disclosure relates to a light emitting device and a methodof fabricating the same.

2. Description of the Background

A light emitting diode refers to a semiconductor device that has a p-nsemiconductor junction, which emits light through electron-holerecombination. Such light emitting diodes are used in a wide range ofapplications, such as display devices, backlights, etc. Furthermore,light emitting diodes have a lower power consumption and longer lifetimethan existing electric bulbs and fluorescent lamps. Thus, light emittingdiodes are being implemented as a substitute for existing electric bulbsand fluorescent lamps used in general illumination.

In recent years, AC light emitting diodes, which are directly connectedto an AC power source to continuously emit light, have been produced.One example of AC light emitting diodes that are directly connected to ahigh voltage AC power source is disclosed in PCT Publication No. WO2004/023568 (A1), entitled “Light emitting device having light emittingelements” by Sakai et al.

According to PCT Publication No. WO 2004/023568 A1, LED elements aretwo-dimensionally connected in series, on an insulation substrate, suchas a sapphire substrate, to form LED arrays. Such LED arrays areconnected to each other, thereby providing a light emitting device thatcan be operated at high voltage. Further, such LED arrays are connectedin reverse parallel to each other, on the sapphire substrate, therebyproviding a single-chip light emitting device that can be operated by anAC power supply.

Since the AC-LED includes light emitting cells formed on the substrate,which is used as a growth substrate, there are limitations to thestructure of the light emitting cells and the light extractionefficiency thereof. To solve such problems, a method of fabricating anAC-LED, through a substrate lift-off process, is disclosed in KoreanPatent No. 10-0599012, entitled “Light emitting diode employingthermally conductive substrate and method of fabricating the same.”

FIGS. 1 to 4 are cross-sectional views illustrating a conventionalmethod of fabricating a light emitting device. Referring to FIG. 1,semiconductor layers, including a buffer layer 23, an N-typesemiconductor layer 25, an active layer 27, and a P-type semiconductorlayer 29, are formed on a sacrificial substrate 21. Further, a firstmetal layer 31 is formed on the semiconductor layers, and a second metallayer 53 is formed on a substrate 51 separate from the sacrificialsubstrate 21. The first metal layer 31 may include a reflective metallayer. The second metal layer 53 is bonded to the first metal layer 31,so that the substrate 51 is bonded to an upper portion of thesemiconductor layers.

Referring to FIG. 2, after bonding the substrate 51, the sacrificialsubstrate 21 is removed using a laser lift-off process. Further, afterthe sacrificial substrate 21 is removed, the remaining buffer layer 23is removed, and the surface of the N-type semiconductor layer 25 isexposed.

Referring to FIG. 3, the semiconductor layers 25, 27, 29 and the metallayers 31, 53 are subjected to a patterning process, usingphotolithography and etching technologies, to form separate metalpatterns 40 and light emitting cells 30 located on the metal patterns40. Each of the light emitting cells 30 includes a P-type semiconductorlayer 29 a, an active layer 27 a, and an N-type semiconductor layer 25a, which are subjected to patterning.

Referring to FIG. 4, metal wires 57 are formed to electrically connectupper surfaces of the light emitting cells 30 to the metal patterns 40adjacent thereto. The metal wires 57 connect the light emitting cells 30to each other, to form series arrays of the light emitting cells. Inorder to connect the metal wires 57 to the light emitting cells,electrode pads 55 may be formed on the N-type semiconductor layers 25 a,and electrode pads may also be formed on the metal patterns 40. Two ormore series arrays may be formed and connected in reverse parallel toeach other, thereby providing a light emitting diode that can be drivenby an AC power source.

As such, the conventional method can improve the heat dissipation of thelight emitting device, through appropriate selection of the substrate51, and can enhance a light extraction efficiency via treatment of thesurface of the N-type semiconductor layer 25 a. Further, since the firstmetal layer 31 a includes the reflective metal layer to reflect lightradiated from the light emitting cells 30 towards the substrate 51, theluminous efficiency may be further improved.

However, such a conventional method may cause a short circuit betweenthe N-type semiconductor layer 25 a and the P-type semiconductor layer29 a, due to the adhesion of metallic etching by-products to sidewallsof the light emitting cells 30, during the patterning of thesemiconductor layers 25, 27, 29 and the metal layers 31, 53. Further,when etching the semiconductor layers 25, 27, 29, the surface of thefirst metal layer 31 a is exposed and is likely to be damaged by plasma.When the first metal layer 31 a includes a Ag or Al reflective metallayer, such etching damage is more pronounced. The plasma damage to thesurface of the metal layer 31 a deteriorates the contact between thewires 57 or electrode pads, and the metal layer, thereby increasingdevice failure rates.

In the conventional method, the first metal layer 31 may include thereflective metal layer and thus, may reflect light from the lightemitting cells 30 away from the substrate. However, the reflective metallayer is disposed in a space between the light emitting cells 30 andthus, is frequently damaged by etching and/or oxidation, reducing thereflectivity thereof.

Furthermore, since the substrate 51 is exposed between the metalpatterns 40, light can be absorbed by the substrate 51, thereby causingoptical loss. Moreover, since the wires 57 are connected to an upperlight emitting surface of the N-type semiconductor layer 25 a, lightproduced by the active layer 25 a can be absorbed by the wires 57 and/orthe electrode pads 55 located on the light emitting surface, therebyincreasing optical loss.

SUMMARY OF THE INVENTION

Exemplary embodiments of the invention provide a light emitting devicefor high voltage operations that may prevent electric short circuits inlight emitting cells, due to metallic etching by-products, and a methodof fabricating the same.

Further exemplary embodiments of the invention provide a light emittingdevice that may reduce the loss of light directed towards a substrate,in a space between light emitting cells, and a method of fabricating thesame.

Further exemplary embodiments of the invention provide a light emittingdevice that may reduce the loss of light emitted from a light emittingsurface, to improve overall luminous efficiency, and a method offabricating the same.

Further exemplary embodiments of the invention provide a light emittingdevice that may assist current spreading in light emitting cells, and amethod of fabricating the same.

Additional features of the invention will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the invention.

An exemplary embodiment of the present invention discloses a lightemitting device. The light emitting device includes: a substrate; firstand second light emitting cells, each including a first semiconductorlayer, an active layer, a second semiconductor layer, and a hole formedthrough the second semiconductor layer and the active layer, to exposethe first semiconductor layer; and a connector located between the firstand second light emitting cells and the substrate, electricallyconnecting the first and second light emitting cells to each other. Theholes may be located at central regions of the first and second lightemitting cells, respectively, and the connector may electrically connectthe second semiconductor layer of the first light emitting cell to theportion of the first semiconductor layer exposed that is through thehole of the second light emitting cell.

Since the connector is located between the substrate and the lightemitting cells, it is possible to prevent the loss of light due to theconnector. Further, since the holes are located at the central regionsof the light emitting cells, the connector can be connected to the firstsemiconductor layers, at the central regions, thereby allowing currentspreading over a wide area of the light emitting cells.

Furthermore, each of the first and second light emitting cells mayinclude a single hole that exposes the first semiconductor layer, but isnot limited thereto. Alternatively, each of the first and second lightemitting cells may include a plurality of holes.

According to some embodiments, the light emitting device may furtherinclude an isolation trench isolating the light emitting cells from eachother, and an insulation layer interposed between the isolation trenchand the connector. When etching the semiconductor layers to form theisolation trench, the insulation layer covers the connector, to protectthe connector from etching damage.

According to some embodiments, the insulation layer may include adistributed Bragg reflector (DBR). Accordingly, it is possible toreflect light, which is radiated from a region between the lightemitting cells towards the substrate, thereby further enhancing theluminous efficiency.

According to some embodiments, the isolation trench may be formedthrough the first semiconductor layer, active layer, and secondsemiconductor layer. Namely, the isolation trench may be formed byetching the first semiconductor layer, active layer, and secondsemiconductor layer, thereby simplifying the process of forming thelight emitting cells.

According to some embodiments, the light emitting device may furtherinclude an insulation layer covering a sidewall of the holes. Theinsulation layer prevents the connector from short circuiting the firstsemiconductor layer and the second semiconductor layer. Furthermore, theinsulation layer may include a DBR. Accordingly, it is possible toprevent light produced in the light emitting cells from being absorbedand lost by the connector, in the hole.

In some embodiments, the light emitting device may further include anohmic contact layer that contacts the second semiconductor layer of eachof the light emitting cells. Here, the connector is insulated from theohmic contact layer of the second light emitting cell, while beingconnected to the ohmic contact layer of the first light emitting cell.In some embodiments, an insulation layer may be interposed between theohmic contact layer of the second light emitting cell and the connector,so that the connector may be insulated from the ohmic contact layer viathe insulation layer.

According to some embodiments, a DBR may be interposed between the ohmiccontact layer and the semiconductor layer. Here, the DBR may includethrough-holes, through which the ohmic contact layer may be connected tothe second semiconductor layer.

According to some embodiments, an isolation insulation layer may beinterposed between the connector and the substrate. The isolationinsulation layer prevents electrical short circuits, by isolating thebonding metal from the connector.

Another exemplary embodiment of the present invention discloses a lightemitting device including: a substrate; a first light emitting cellincluding a first semiconductor layer, an active layer, a secondsemiconductor layer, and a hole formed through the second semiconductorlayer and the active layer, to expose the semiconductor layer; a firstconnector electrically connected to the first semiconductor layer,through the hole; and a second connector electrically connected to thesecond semiconductor layer. The hole may be located at a central regionof the light emitting cell, and the first connector may be electricallyinsulated from the second semiconductor layer. As such, the first andsecond connectors are disposed between the light emitting cells and thesubstrate, to prevent optical loss, and the second connector isconnected to the central region of the light emitting cell, to enhancecurrent spreading in the light emitting cell.

According to some embodiments, the first light emitting cell may includea plurality of holes exposing the first semiconductor layer.

According to some embodiments, an insulation layer may be formed on asidewall of the hole. The insulation layer prevents the second connectorfrom short circuiting the first semiconductor layer and the secondsemiconductor layer. The insulation layer may include a DBR, therebypreventing light produced in the first light emitting cell from beingabsorbed by the second connector.

In some embodiments, the light emitting cell may further include anohmic contact layer that contacts the second semiconductor layer. Thesecond connector may be connected to the ohmic contact layer.Furthermore, the ohmic contact layer may include a reflective metallayer to reflect light produced in the first light emitting cell, awayfrom the substrate.

According to some embodiments, an insulation layer may be interposedbetween the first connector and the ohmic contact layer. As a result,the first connector may be insulated from the ohmic contact layer, viathe insulation layer. The insulation layer may include a DBR.

The light emitting device may further include a second light emittingcell including a first semiconductor layer, an active layer, and asecond semiconductor layer. The second connector may be electricallyconnected to the first semiconductor layer of the second light emittingcell.

In some embodiments, the second light emitting cell may include a holeformed through the semiconductor layer and the active layer, to exposethe first semiconductor layer. The second connector may be electricallyconnected to the first semiconductor layer of the second light emittingcell, through the hole.

According to some embodiments, the first and second light emitting cellsmay be isolated from each other by an isolation trench, and aninsulation layer may be interposed between the isolation trench and thesecond connector. The insulation layer may include a DBR.

As such, the exemplary embodiments of the present invention providelight emitting devices for high voltage operations, which can preventelectrical short circuits in light emitting cells, by preventingmetallic etching by-products from being produced. Further, the lightemitting device employs an insulation layer including a DBR to reflectlight away from the substrate, thereby enhancing the luminous efficiencythereof. In addition, connectors connecting the light emitting cells areburied in the light emitting device, thereby preventing light emittedfrom a light emitting surface from being absorbed by the connectors.Further, the light emitting cells have holed formed at the centralregions thereof, through which the connectors are connected to the firstsemiconductor layers, to assist current spreading in the light emittingcells.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory, andare intended to provide further explanation of the invention, asclaimed.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain variousaspects of the invention.

FIGS. 1, 2, 3, and 4 are cross-sectional views illustrating aconventional method of fabricating a light emitting device.

FIG. 5 is a schematic plan view of a light emitting device, according toone exemplary embodiment of the present invention.

FIG. 6 is a cross-sectional view taken along line A-A in FIG. 5.

FIGS. 7, 8, 9, 10, 11, and 12 are cross sectional-views illustrating amethod of fabricating a light emitting device, according to oneexemplary embodiment of the present invention.

FIG. 13 is a cross-sectional view of a light emitting device, accordingto another exemplary embodiment of the present invention.

DETAILED DESCRIPTION

The present invention is described more fully hereinafter with referenceto the accompanying drawings, in which exemplary embodiments of theinvention are shown. This invention may, however, be embodied in manydifferent forms and should not be construed as limited to the exemplaryembodiments set forth herein. Rather, these exemplary embodiments areprovided so that this disclosure is thorough and will fully convey thescope of the invention to those skilled in the art. In the drawings, thesizes and relative sizes of layers and regions may be exaggerated forclarity. Like reference numerals in the drawings denote like elements.

It will be understood that when an element such as a layer, film, regionor substrate is referred to as being formed or disposed “on” anotherelement, it can be disposed directly on the other element, orintervening elements may also be present. In contrast, when an elementis referred to as being formed or disposed “directly on” anotherelement, there are no intervening elements present. In addition, when anelement is referred to as being connected to another element, it can bedirectly connected to the other element, or it may be indirectlyconnected to the other element, via intervening elements. In contrast,when an element is referred to as being directly connected to anotherelement, no intervening elements are present therebetween.

FIG. 5 is a schematic plan view of a light emitting device, according toone exemplary embodiment of the present invention, and FIG. 6 is across-sectional view taken along line A-A in FIG. 5. Referring to FIGS.5 and 6, the light emitting device includes a substrate 151, a firstlight emitting cell S1, a second light emitting cell S2, an isolationtrench 161, and connectors 135. Further, the light emitting device mayinclude holes 130 a, an ohmic contact layer 131, an insulation layer133, an isolation insulation layer 137, an adhesion layer 139, and abonding metal 141. In some embodiments, the light emitting device mayfurther include a protective insulation layer (not shown).

The substrate 151 is distinguished from a growth substrate for growingcompound semiconductors and is a substrate to be attached to compoundsemiconductors that have been already grown. The substrate 151 may be asapphire substrate, but is not limited thereto. Alternatively, thesubstrate 151 may be a different kind of insulation, or conductive,substrate. In particular, when using a sapphire substrate as the growthsubstrate for semiconductors, it is generally desirable that thesubstrate 151 be a sapphire substrate, so as to have the same thermalexpansion coefficient as the growth substrate.

The light emitting cells S1, S2 are isolated from each other by theisolation trench 161. Each of the light emitting cells S1, S2 includes asemiconductor stack 130, which includes a first (upper) semiconductorlayer 125, an active layer 127, and a second (lower) semiconductor layer129. The active layer 127 is interposed between the first semiconductorlayer 125 and the second semiconductor layer 129. Each of the lightemitting cells S1, S2 includes a hole 130 a formed through the secondsemiconductor layer 129 and the active layer 127, to expose a portion ofthe first semiconductor layer 125. The holes 130 a are located atcentral regions of the light emitting cells S1, S2, respectively. Eachof the light emitting cells S1, S2 may include a single hole 130 a, butthe present invention is not limited thereto. For example, each of thelight emitting cells S1, S2 may include a plurality of the holes 130 a.

The active layer 127 and the first and second semiconductor layers 125,129 may be formed of III-N-based compound semiconductors, for example,(Al, Ga, In)N semiconductors. Each of the first and second semiconductorlayers 125, 129 may include a single layer or multiple layers. In someembodiments, the first and/or second semiconductor layers 125, 129 mayinclude a contact layer and a cladding layer. In other embodiments, thefirst and/or second semiconductor layers 125, 129 may further include asuper lattice layer. The active layer 127 may have a single quantum wellstructure or a multi-quantum well structure. In some embodiments, thefirst semiconductor layer 125 is an n-type layer, and the secondsemiconductor layer 129 is a p-type layer. Since the first semiconductorlayers 125 may be n-type semiconductor layers, which have a relativelylow resistance, it is possible to form the first semiconductor layers125 to a relatively large thickness. Accordingly, a roughened surface Rcan be easily formed on an upper surface of the first semiconductorlayers 125, thereby enhancing the extraction efficiency of lightproduced in the active layer 127.

The isolation trenches 161 are formed through the first semiconductorlayer 125, active layer 127, and second semiconductor layer 129, so thatinner walls of the isolation trenches 161 are formed by thesemiconductor stack 130. Since all of the isolation trenches 161 may beformed with the same depth, an etching process for forming the isolationtrenches 161 may be stably performed.

The connectors 135 are located between the light emitting cells S1, S2and the substrate 151, to electrically connect the light emitting cellsS1, S2 to each other. The connectors 135 provide an electricalconnection between light emitting cells. Specifically, the connectorsare each electrically connected to the first semiconductor layer 125 ofone light emitting cell and are connected to the second semiconductorlayer 129 of another one of the light emitting cells. Further, each ofthe connectors 135 electrically connects adjacent light emitting cellsto each other. For example, the connector 135 electrically connects thesecond semiconductor layer 129 of the first light emitting cell S1 tothe first semiconductor layer 125 of the second light emitting cell S2.Here, the connector 135 may be electrically connected to the portion ofthe first semiconductor layer 125 exposed through the hole 130 a of thesecond light emitting cell. Specifically, the connector 135 may extendfrom second semiconductor layer 129 of the first light emitting cell S1,across the substrate 151, and through the second semiconductor layer 129and active layer 127 of the second light emitting cell S2, so as tocontact the first semiconductor layer 125 of the second light emittingcell S2. According to some embodiments, the portion of the connector 135that extends into the second light emitting cell S2 may be cone-shaped,with the tip of the cone contacting the first semiconductor layer 125.However, this portion of the connector 135 is not limited to anyparticular shape.

As such, a plurality of light emitting cells may be connected in seriesto one another, via the connectors 135, to form a series array of thelight emitting cells. Thus, the light emitting device can be operated ata high voltage. Further, a plurality of series arrays may be providedand connected in reverse parallel to one another, thereby providing anAC light emitting device, which can be operated by an AC power source.

The ohmic contact layer 131 may contact to the second semiconductorlayer 129. The ohmic contact layer 131 contacts most of the lowersurface of the second semiconductor layer 129, to facilitate currentspreading in the light emitting cells S1, S2. The ohmic contact layer131 may include a reflective metal layer and thus, may reflect lightradiated from the light emitting cells S1, S2, away from the substrate151. Here, the connector 135 electrically connected to the secondsemiconductor layer 129 of the first light emitting cell Si may beconnected to the ohmic contact layer 131 disposed under the lightemitting cell S1. The connector 135 is insulated from the secondsemiconductor layer 129 and the ohmic contact layer 131, of the secondlight emitting cell S2, while being electrically connected to the firstsemiconductor layer 125 of the second light emitting cell S2.

The insulation layer 133 is interposed between the isolation trench 161and the connector 135, to prevent the connector 135 from being exposedto the outside. Therefore, while the isolation trench 161 is beingformed by etching, it is possible to protect the connectors from etchingdamage.

The insulation layer 133 is located on a sidewall (inside) of the holes130 a, to prevent the connectors 135 from short circuiting the first andsecond semiconductor layers 125, 129. Further, the insulation layer 133is interposed between the ohmic contact layer 131 and the connectors135, to insulate the ohmic contact layer 131 and the connectors 135 fromeach other.

In this embodiment, the insulation layer on the holes 130 a, theinsulation layer for preventing etching damage, and the insulation layeron the ohmic contact layer 131 may be formed as a single insulationlayer 133 and may include a distribution Bragg reflector (DBR).Alternatively, these insulation layers may be separately formed bydifferent processes.

The bonding metal 141 may be interposed between the light emitting cellsS1, S2 and the substrate 151. The bonding metal 141 may be formed ofmetallic materials, for example, Au/Sn, to bond the substrate 151 to thelight emitting cells S1, S2. Further, the isolation insulation layer 137may be interposed between the light emitting cells S1, S2 and thebonding metal 141, to electrically insulate the connectors 135 from thebonding metal 141. In some embodiments, the adhesion layer 139 may beformed of, for example, Cr/Au, and may be formed under the isolationinsulation layer 137, to enhance an adhesive force of the bonding metal141.

The first semiconductor layer 125 may include a roughened surface R.Further, a protective insulation layer (not shown) may cover the lightemitting cells Si and S2, to protect the light emitting cells. Theprotective insulation layer may fill the isolation trench 161.

FIGS. 7 to 12 are cross-sectional views illustrating a method offabricating a light emitting device, according to one exemplaryembodiment of the present invention. Referring to FIG. 7, asemiconductor stack 130, including compound semiconductor layers, isformed on a sacrificial substrate 121. The sacrificial substrate 121 maybe a sapphire substrate, but is not limited thereto. Alternatively, thesacrificial substrate 121 may be a heterogeneous substrate. The compoundsemiconductor layers may include a first semiconductor layer 125, asecond semiconductor layer 129, and an active layer 127 interposedbetween the first and second semiconductor layers 125, 129. The firstsemiconductor layer 125 is located closer to the sacrificial substrate121 than the second semiconductor layer 129. Each of the first andsecond semiconductor layers 125, 129 may be in the form of a singlelayer, or may be formed as multiple layers. Further, the active layer127 may have a single quantum well structure or a multi-quantum wellstructure.

The compound semiconductor layers 125, 127, 129 may be formed of III-Nbased compound semiconductors disposed on the sacrificial substrate 121,by metal organic chemical vapor deposition (MOCVD) or molecular beamepitaxy (MBE). A buffer layer (not shown) may be formed before theformation of the compound semiconductor layers 125, 127, 129. The bufferlayer is employed to relieve lattice mismatches between the sacrificialsubstrate 121 and the compound semiconductor layers 125, 127, 129. Thebuffer layer may be formed of a nitride-based material, such as galliumnitride or aluminum nitride.

Holes 130 a are formed to expose the first semiconductor layer 125, bypatterning the semiconductor stack 130. The holes 130 a are formed atcentral regions of light emitting cells, to connect connectors to thefirst semiconductor layer 125. Side surfaces of the active layer 127 andthe second semiconductor layer 129 are exposed on inner walls of theholes 130 a.

To form the holes 130, the compound semiconductor layers are subjectedto patterning by photolithography and etching, which are very similar toa mesa etching process. However, the mesa etching process is generallyperformed to provide a mesh shape, so as to isolate the secondsemiconductor layers 129 of the light emitting cells from each other,whereas the holes 130 a are separated from each other in variousembodiments of the invention. Accordingly, the holes 130 a may bereduced in area, to allow an isolation insulation layer and a bondingmetal to be easily flattened, so that the substrate 151 can be stablyattached to the semiconductor layers.

Referring to FIG. 8, an ohmic contact layer 131 may be formed on thesecond semiconductor layer 129. The ohmic contact layer 131 may form anohmic contact with the second semiconductor layer 129. The ohmic contactlayer 131 is formed on each of the light emitting cells and has anopening that exposes each of the holes 130 a. The ohmic contact layer131 may include a reflective metal layer. In some embodiments, the ohmiccontact layer 131 may include a barrier layer to protect the reflectivemetal layer.

An insulation layer 133 may be formed to cover a sidewall of the holes130 a, while covering a portion of the ohmic contact layer 131. Theinsulation layer 133 covers a portion of the second semiconductor layer129 located between the light emitting cells. The portions of theinsulation layer 133 covering the sidewalls of the holes 130 a, disposedon the ohmic contact layer 131, and located between the light emittingcells may be formed of the same material by the same process.Alternatively, these portions of the insulation layer 133 may be formedby different processes, and/or may be separated from one another. Theinsulation layer 133 may be formed of, for example, SiO2, SiN, MgO, TaO,TiO2, or a polymer, and may include a distributed Bragg reflector (DBR).

Referring to FIG. 9, connectors 135 are formed on the insulation layer133. Each of the connectors 135 electrically connects a portion of thefirst semiconductor layer 125 exposed in the hole 130 a, to the secondsemiconductor layer 129 in an adjacent light emitting cell. Theconnector 135 that is electrically connected to the second semiconductorlayer 129 may be connected to the ohmic contact layer 131. Here, it isdesirable that the connector 135 be insulated from the ohmic contactlayer 131 and the second semiconductor layer 129, in some regions. Tothis end, an insulation layer 133 is interposed between the connector135 and the ohmic contact layer 131, in such regions.

Referring to FIG. 10, an isolation insulation layer 137 is formed tosubstantially cover a surface of the sacrificial substrate 121, on whichthe connectors 135 are formed. The isolation insulation layer 137 maycompletely cover lower surfaces of the connectors 135 and the insulationlayer 133. The isolation insulation layer 137 may be formed of a siliconoxide film, a silicon nitride film, or the like. Further, the isolationinsulation layer 137 may be a DBR with SiO2/TiO2 periodically formedtherein. An adhesion layer 139 may be formed on the isolation insulationlayer 137, and a bonding metal 141 may be formed on the adhesion layer139. Then, the substrate 151 may be bonded to the bonding metal 141. Thebonding metal 141 may be formed of, for example, AuSn (80/20 wt %). Thesubstrate 151 may have the same thermal expansion coefficient as thesacrificial substrate 121. In some embodiments, the substrate 151 may bea sapphire substrate, but is not limited thereto.

Referring to FIG. 11, the sacrificial substrate 121 is then removed toexpose the first semiconductor layer 125. The sacrificial substrate 121may be removed via laser lift-off (LLO) or other mechanical or chemicaltechniques. Here, the buffer layer is also removed to expose the firstsemiconductor layer 125.

Referring to FIG. 12, an isolation trench 161 is formed to divide thesemiconductor stack 130 into light emitting cells S1, S2. The isolationtrench 161 is formed by etching the semiconductor stack 130 until theinsulation layer 133 is exposed. Here, the insulation layer 133 preventsthe connectors 135 from being exposed. A sidewall of the isolationtrench 161 is formed of the semiconductor stack 130, and the sidesurfaces of the first semiconductor layer 125, active layer 127, andsecond semiconductor layer 129 are exposed in the isolation trench. Aroughened surface R may be formed on the first semiconductor layer 125,by a photo-enhanced chemical (PEC) etching or the like.

Then, a protective insulation layer (not shown) and electrode pads (notshown) are formed on the first semiconductor layers 125. The substrate151 is divided into light emitting device units, each including thelight emitting cells S1, S2, thereby providing a single chip lightemitting device.

FIG. 13 is a cross-sectional view of a light emitting device, accordingto another exemplary embodiment of the present invention. Referring toFIG. 13, the light emitting device according to this embodiment has asimilar structure to the light emitting device described with referenceto FIGS. 5 and 6, so only the differences there between will bedescribed in detail. In particular, the light emitting device of FIG. 13includes a DBR 170 and an ohmic contact layer 171.

The DBR 170 is interposed between the ohmic contact layer 171 and asecond semiconductor layer 129. The DBR 170 may cover the sidewalls ofholes 130 a formed in the second semiconductor layer 120. The DBR 170may be interposed between an isolation trench 161 and a connector 175.

The DBR 170 may include through-holes 170 a disposed between the ohmiccontact layer 171 and the second semiconductor layer 129. The ohmiccontact layer 171 may be connected to the second semiconductor layer129, through the through-holes 170 a. The DBR 170 is formed on thesidewalls (inside) of the holes 130 a, between the ohmic contact layer171 and the semiconductor layer 129, and on between the isolation trench161 and the connector 175. The DBR 170 improves the reflection of lightproduced in the light emitting cells S1, S2 and thus, improves luminousefficiency.

An insulation layer 173 is formed on regions of the ohmic contact layer171. The insulation layer 173 electrically insulates the connector 175from the ohmic contact layer 171

Although the aspects of the present invention have been illustrated withreference to various exemplary embodiments, it will be apparent to thoseskilled in the art that various modifications can be made to theexemplary embodiments, without departing from the spirit and scope ofthe invention. Therefore, it should be understood that the exemplaryembodiments are provided by way of illustration only and are given toprovide a complete disclosure of the invention and a thoroughunderstanding of the invention to those skilled in the art. Thus, thepresent invention is intended to cover the various modifications,provided they come within the scope of the appended claims and theirequivalents.

1. A light-emitting device, comprising: a substrate; and a firstlight-emitting diode arranged on the substrate, the first light-emittingdiode comprising: a first inclined surface comprising an outside surfaceof the first light-emitting diode; a second inclined surface comprisingan inside surface of the first light-emitting diode; and a thirdinclined surface comprising an upper part of the first light-emittingdiode, wherein the length of the second inclined surface and the thirdinclined surface is less than the length of the first inclined surface.2. The light-emitting device of claim 1, wherein the firstlight-emitting diode further comprises: a first-type semiconductorlayer; a second-type semiconductor layer; and an active layer arrangedbetween the first-type semiconductor layer and the second-typesemiconductor layer, wherein a portion of the first-type semiconductorlayer and the active layer are removed, and a portion of the second-typesemiconductor layer is exposed.
 3. The light-emitting device of claim 2,further comprising: a first electrode contacting the first-typesemiconductor layer and the substrate; and a second electrode contactingthe exposed portion of the second-type semiconductor layer and thesubstrate.
 4. The light-emitting device of claim 3, further comprising:a first insulation layer arranged between the first electrode and thesecond electrode; and a second insulation layer arranged between a sidesurface of first-type semiconductor layer and the second electrode. 5.The light-emitting device of claim 3, wherein a first portion of thefirst electrode and a first portion of the second electrode are arrangedat the same depth in the substrate, and the first electrode and thesecond electrode are spaced apart from each other.
 6. The light-emittingdevice of claim 4, wherein the second insulation layer comprises aplurality of holes, and the first electrode and the second electroderespectively contact the first-type semiconductor layer and thesecond-type semiconductor layer through the holes.
 7. The light-emittingdevice of claim 4, wherein the first insulation layer comprises a stackof at least two different oxide insulation layers.
 8. The light-emittingdevice of claim 3, wherein the first electrode comprises a reflectorlayer and a barrier layer.
 9. The light-emitting device of claim 3,further comprising a second light-emitting diode serially connected tothe first light-emitting diode.
 10. The light-emitting device of claim9, wherein a first end of the second electrode contacts the second-typesemiconductor layer of the first light-emitting diode, and a second endof the second electrode contacts the first-type semiconductor layer ofthe second light-emitting diode.
 11. A light-emitting device,comprising: a substrate; and a first light-emitting diode arranged onthe substrate, the first light-emitting diode comprising: a firstinclined surface comprising an outside surface of the firstlight-emitting diode; a second inclined surface comprising an insidesurface of the first light- emitting diode; a third inclined surfacecomprising an upper part of the first light-emitting diode, wherein thelength of the second inclined surface and the third inclined surface isless than the length of the first inclined surface; a first-typesemiconductor layer; a second-type semiconductor layer; and an activelayer arranged between the first-type semiconductor layer and thesecond-type semiconductor layer, wherein a portion of the first-typesemiconductor layer and the active layer are removed, and a portion ofthe second-type semiconductor layer is exposed; a first electrodecontacting the first-type semiconductor layer and the substrate; asecond electrode contacting the exposed portion of the second-typesemiconductor layer and the substrate; a first insulation layer arrangedbetween the first electrode and the second electrode; and a secondinsulation layer arranged between a side surface of first-typesemiconductor layer and the second electrode, wherein a first portion ofthe first electrode and a first portion of the second electrode arearranged at the same depth in the substrate, and the first electrode andthe second electrode are spaced apart from each other.
 12. Thelight-emitting device of claim 11, wherein the second insulation layercomprises a plurality of holes, and the first electrode and the secondelectrode respectively contact the first-type semiconductor layer andthe second-type semiconductor layer through the holes.
 13. Thelight-emitting device of claim 11, wherein the first insulation layercomprises a stack of at least two different oxide insulation layers. 14.The light-emitting device of claim 11, wherein the first electrodecomprises a reflector layer and a barrier layer.
 15. The light-emittingdevice of claim 11, further comprising a second light-emitting diodeserially connected to the first light-emitting diode.
 16. Thelight-emitting device of claim 15, wherein a first end of the secondelectrode contacts the second-type semiconductor layer of the firstlight-emitting diode, and a second end of the second electrode contactsthe first-type semiconductor layer of the second light-emitting diode.